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Stazioni Reballing BGA
Stazioni Reballing BGA: reballing professionale. 89+ disponibili.
Stazioni Reballing BGA
Complete equipment for BGA reballing and rework: infrared stations, reflow ovens, PCB preheaters, direct and universal BGA stencils, solder balls in various diameters (0.2mm to 0.76mm), and reballing jigs. Brands such as Achi, LY, Scotle, and Infrared BGA. Professional solutions for GPU, chipset, and processor repair on consoles and laptops.
What do I need for GPU and BGA chip reballing?
For BGA reballing you need: a hot air or infrared station with precise temperature control, a PCB preheater to prevent warping, specific BGA stencils for the chip being repaired, solder balls of the correct diameter (usually 0.5mm or 0.6mm for GPUs), BGA flux (such as Amtech), and a reballing jig or fixture. For console chips (PS3, Xbox 360), direct stencils greatly simplify the process.
Chipset grafico GF-Go7400-B-N-A3 nuovo e reballato senza piombo AMD
Chipset grafico NF-SPP-100-N-A2 nuovo e reballato senza piombo AMD
Forno reflow a infrarossi T-962A Puhui V2.0 per saldatura SMD e BGA
Kit di Reballing HT-90 90x90 per Saldatura Precisa ed Efficiente
Kit di Reballing MK-15 90x90 per saldatura elettronica professionale
Kit Reballing Mobile Doppio Ajuste Compatibile con Stencil 80 mm e 90 mm
Pack 10 stencil universali BGA reballing calore diretto da 0,3 a 0,76 mm
Pack 6 stencil reballing per chip memoria DDR, DDR2, DDR3 e GDDR5
Pack stencil calore diretto console - 15 sagome per riparazione professionale
